Patent US5575707 - Polishing pad cluster for polishing a semiconductor wafer - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inAdvanced Patent SearchPatentsA polishing pad cluster for polishing a semiconductor wafer having multiple integrated circuit dies includes a pad support and multiple polishing pads. Each pad has a polishing area substantially smaller than the wafer but not substantially smaller than an individual one of the integrated circuit dies....http://www.google.com/patents/US5575707?utm_source=gb-gplus-sharePatent US5575707 - Polishing pad cluster for polishing a semiconductor waferAdvanced Patent SearchPublication numberUS5575707 APublication typeGrantApplication numberUS 08/321,169Publication dateNov 19, 1996Filing dateOct 11, 1994Priority dateOct 11, 1994Fee statusLapsedAlso published asDE69512170D1, DE69512170T2, DE69525665D1, DE69525665T2, EP0706856A1, EP0706856B1, EP0919330A1, EP0919330B1Publication number08321169, 321169, US 5575707 A, US 5575707A, US-A-5575707, US5575707 A, US5575707AInventorsHomayoun Talieh, David E. WeldonOriginal AssigneeOntrak Systems, Inc.Export CitationBiBTeX, EndNote, RefManPatent Citations (17), Non-Patent Citations (4), Referenced by (99), Classifications (13), Legal Events (9) External Links: USPTO, USPTO Assignment, EspacenetPolishing pad cluster for polishing a semiconductor waferUS 5575707 AAbstract A polishing pad cluster for polishing a semiconductor wafer having multiple integrated circuit dies includes a pad support and multiple polishing pads. Each pad has a polishing area substantially smaller than the wafer but not substantially smaller than an individual one of the integrated circuit dies. Each polishing pad is mounted to a respective polishing pad mount, which is in turn supported by the support. Each mount includes a respective joint having at least two degrees of freedom to allow the associated polishing pad to articulate with respect to the support to conform to the wafer. Each mount is substantially rigid in a direction perpendicular to the pad toward the pad support, and in some cases the adjacent mounts are completely isolated from one another. A magnet is used to bias the polishing pad against the wafer.
Patent CitationsCited PatentFiling datePublication dateApplicantTitleUS3654739 *Feb 5, 1970Apr 11, 1972Metabowerke KgBelt grinding or polishing machineUS4128968 *Sep 22, 1976Dec 12, 1978The Perkin-Elmer CorporationOptical surface polisherUS4601134 *Jan 14, 1985Jul 22, 1986Karl Heesemann Maschinenfabrik Gmbh & Co. KgBelt grinder having pressure pads with individually variable contact pressuresUS4802309 *Aug 6, 1987Feb 7, 1989Carl-Zeiss-StiftungMethod and apparatus for lapping and polishing optical surfacesUS4811522 *Mar 23, 1987Mar 14, 1989Gill Jr Gerald LCounterbalanced polishing apparatusUS5205082 *Dec 20, 1991Apr 27, 1993Cybeq Systems, Inc.Wafer polisher head having floating retainer ringUS5212910 *Jul 9, 1991May 25, 1993Intel CorporationComposite polishing pad for semiconductor processUS5230184 *Jul 5, 1991Jul 27, 1993Motorola, Inc.Distributed polishing headUS5287663 *Apr 28, 1992Feb 22, 1994National Semiconductor CorporationPolishing pad and method for polishing semiconductor wafersUS5297361 *Jul 16, 1993Mar 29, 1994Commissariat A L'energie AtomiquePolishing machine with an improved sample holding tableUS5329732 *Jun 15, 1992Jul 19, 1994Speedfam CorporationWafer polishing method and apparatusUS5329734 *Apr 30, 1993Jul 19, 1994Motorola, Inc.Polishing pads used to chemical-mechanical polish a semiconductor substrateUS5335453 *Sep 27, 1993Aug 9, 1994Commissariat A L'energie AtomiquePolishing machine having a taut microabrasive strip and an improved wafer support headEP0118126A2 *Mar 3, 1984Sep 12, 1984Aida Engineering Ltd.Magnetic attraction system grinding methodEP0478912A2 *Jul 23, 1991Apr 8, 1992Peter Wolters AgWorking disc for lapping, honing and polishing machineFR796866A * Title not availableJPS5914469A * Title not available* Cited by examinerNon-Patent CitationsReference1"A New Pad and Equipment Development for ILD Planarization" by Toshiyasu Beppu, Motoyuki Obara and Yausuo Minamikawa, Semiconductor World, Jan., 1994, MY Mar. 17, 1994.2"Application of Chemical Mechanical Polishing to the Fabrication of VLSI Circuit Interconnections", William J. Patrick, William L. Guthrie, Charles L. Stadley and Paul M. Schiable, J. Electrochem. Soc., vol. 138, No. 6, Jun. 1991, pp. 1778-1784.3 *A New Pad and Equipment Development for ILD Planarization by Toshiyasu Beppu, Motoyuki Obara and Yausuo Minamikawa, Semiconductor World, Jan., 1994, MY Mar. 17, 1994.4 *Application of Chemical Mechanical Polishing to the Fabrication of VLSI Circuit Interconnections , William J. Patrick, William L. Guthrie, Charles L. Stadley and Paul M. Schiable, J. Electrochem. Soc., vol. 138, No. 6, Jun. 1991, pp. 1778 1784.* Cited by examinerReferenced byCiting PatentFiling datePublication dateApplicantTitleUS5722877 *Oct 11, 1996Mar 3, 1998Lam Research CorporationTechnique for improving within-wafer non-uniformity of material removal for performing CMPUS5916012 *Jun 25, 1997Jun 29, 1999Lam Research CorporationControl of chemical-mechanical polishing rate across a substrate surface for a linear polisherUS5961372 *Dec 5, 1995Oct 5, 1999Applied Materials, Inc.Substrate belt polisherUS6030275 *Mar 17, 1998Feb 29, 2000International Business Machines CorporationVariable control of carrier curvature with direct feedback loopUS6036586 *Jul 29, 1998Mar 14, 2000Micron Technology, Inc.Apparatus and method for reducing removal forces for CMP padsUS6059643 *Feb 21, 1997May 9, 2000Aplex, Inc.Apparatus and method for polishing a flat surface using a belted polishing padUS6062133 *Apr 7, 1999May 16, 2000Micron Technology, Inc.Global planarization method and apparatusUS6068542 *Jun 25, 1997May 30, 2000Tomoe Engineering Co, Ltd.Pad tape surface polishing method and apparatusUS6083839 *Dec 31, 1997Jul 4, 2000Intel CorporationUnique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process controlUS6086460 *Nov 9, 1998Jul 11, 2000Lam Research CorporationMethod and apparatus for conditioning a polishing pad used in chemical mechanical planarizationUS6126512 *Jul 10, 1998Oct 3, 2000Aplex Inc.Robust belt tracking and control system for hostile environmentUS6146249 *Oct 22, 1998Nov 14, 2000Aplex, Inc.Apparatus and method for polishing a flat surface using a belted polishing padUS6155913 *Apr 12, 1999Dec 5, 2000Chartered Semiconductor Manuf. Ltd.Double polishing headUS6179709Feb 4, 1999Jan 30, 2001Applied Materials, Inc.In-situ monitoring of linear substrate polishing operationsUS6200199Mar 31, 1998Mar 13, 2001Applied Materials, Inc.Chemical mechanical polishing conditionerUS6218316Oct 22, 1998Apr 17, 2001Micron Technology, Inc.Planarization of non-planar surfaces in device fabricationUS6237483Mar 30, 2000May 29, 2001Micron Technology, Inc.Global planarization method and apparatusUS6241585Jun 25, 1999Jun 5, 2001Applied Materials, Inc.Apparatus and method for chemical mechanical polishingUS6261959Mar 31, 2000Jul 17, 2001Lam Research CorporationMethod and apparatus for chemically-mechanically polishing semiconductor wafersUS6269511Oct 4, 2000Aug 7, 2001Micron Technology, Inc.Surface cleaning apparatusUS6273100Aug 27, 1998Aug 14, 2001Micron Technology, Inc.Surface cleaning apparatus and methodUS6296550Nov 16, 1998Oct 2, 2001Chartered Semiconductor Manufacturing Ltd.Scalable multi-pad design for improved CMP processUS6306019Dec 30, 1999Oct 23, 2001Lam Research CorporationMethod and apparatus for conditioning a polishing padUS6315857 *Jul 10, 1998Nov 13, 2001Mosel Vitelic, Inc.Polishing pad shaping and patterningUS6316363Sep 2, 1999Nov 13, 2001Micron Technology, Inc.Deadhesion method and mechanism for wafer processingUS6328637Jul 10, 2000Dec 11, 2001Lam Research CorporationMethod and apparatus for conditioning a polishing pad used in chemical mechanical planarizationUS6328642Feb 14, 1997Dec 11, 2001Lam Research CorporationIntegrated pad and belt for chemical mechanical polishingUS6331488May 23, 1997Dec 18, 2001Micron Technology, Inc.Planarization process for semiconductor substratesUS6336845Nov 12, 1997Jan 8, 2002Lam Research CorporationMethod and apparatus for polishing semiconductor wafersUS6336851Aug 4, 1999Jan 8, 2002Applied Materials, Inc.Substrate belt polisherUS6361414Jun 30, 2000Mar 26, 2002Lam Research CorporationApparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization processUS6361423Dec 22, 2000Mar 26, 2002Applied Materials, Inc.Chemical mechanical polishing conditionerUS6390890Feb 3, 2000May 21, 2002Charles J MolnarUsing abrasive mixture of resin and particlesUS6398905Jan 6, 2000Jun 4, 2002Micron Technology, Inc.Fluoropolymer coating on a platen allows for removal of polishing pads with pressure sensitive adhesives; used for smoothening semiconductor wafers and optical lensesUS6402591Mar 31, 2000Jun 11, 2002Lam Research CorporationPlanarization system for chemical-mechanical polishingUS6403499Feb 21, 2001Jun 11, 2002Micron Technology, Inc.Planarization of non-planar surfaces in device fabricationUS6406363Aug 31, 1999Jun 18, 2002Lam Research CorporationUnsupported chemical mechanical polishing beltUS6416385Jun 22, 2001Jul 9, 2002Lam Research CorporationMethod and apparatus for polishing semiconductor wafersUS6425812Dec 30, 1999Jul 30, 2002Lam Research CorporationPolishing head for chemical mechanical polishing using linear planarization technologyUS6428394Mar 31, 2000Aug 6, 2002Lam Research CorporationMethod and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feedUS6431959Dec 20, 1999Aug 13, 2002Lam Research CorporationSystem and method of defect optimization for chemical mechanical planarization of polysiliconUS6435952Jun 30, 2000Aug 20, 2002Lam Research CorporationApparatus and method for qualifying a chemical mechanical planarization processUS6454641 *Nov 7, 2000Sep 24, 2002David E. WeldonHydrostatic fluid bearing support with adjustable inlet heightsUS6495464Jun 30, 2000Dec 17, 2002Lam Research CorporationMethod and apparatus for fixed abrasive substrate preparation and use in a cluster CMP toolUS6500056Jun 30, 2000Dec 31, 2002Lam Research CorporationLinear reciprocating disposable belt polishing method and apparatusUS6506679Aug 29, 2001Jan 14, 2003Micron Technology, Inc.Deadhesion method and mechanism for wafer processingUS6517418Jun 22, 2001Feb 11, 2003Lam Research CorporationMethod of transporting a semiconductor wafer in a wafer polishing systemUS6518172Aug 29, 2000Feb 11, 2003Micron Technology, Inc.Method for applying uniform pressurized film across waferUS6533646Dec 21, 2000Mar 18, 2003Lam Research CorporationPolishing head with removable subcarrierUS6554688Jan 4, 2001Apr 29, 2003Lam Research CorporationMethod and apparatus for conditioning a polishing pad with sonic energyUS6585563Nov 28, 2000Jul 1, 2003Applied Materials, Inc.In-situ monitoring of linear substrate polishing operationsUS6607425 *Dec 21, 2000Aug 19, 2003Lam Research CorporationPressurized membrane platen design for improving performance in CMP applicationsUS6609961Jan 9, 2001Aug 26, 2003Lam Research CorporationChemical mechanical planarization belt assembly and method of assemblyUS6612917Feb 7, 2001Sep 2, 20033M Innovative Properties CompanyAbrasive article suitable for modifying a semiconductor waferUS6616801Mar 31, 2000Sep 9, 2003Lam Research CorporationMethod and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process pathUS6626743Mar 31, 2000Sep 30, 2003Lam Research CorporationMethod and apparatus for conditioning a polishing padUS6632129Feb 15, 2001Oct 14, 20033M Innovative Properties CompanyFixed abrasive article for use in modifying a semiconductor waferUS6641463 *May 20, 2002Nov 4, 2003Beaver Creek Concepts IncUnitary refining element having a plurality of discrete refining members for refining a semiconductor wafer; members comprising multiphase polymeric compositionUS6645046Jun 30, 2000Nov 11, 2003Lam Research CorporationConditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafersUS6645052Oct 26, 2001Nov 11, 2003Lam Research CorporationMethod and apparatus for controlling CMP pad surface finishUS6653722Mar 12, 2002Nov 25, 2003Micron Technology, Inc.Method for applying uniform pressurized film across waferUS6656025Sep 20, 2001Dec 2, 2003Lam Research CorporationSeamless polishing surfaceUS6666756Mar 31, 2000Dec 23, 2003Lam Research CorporationWafer carrier head assemblyUS6677252Jun 6, 2002Jan 13, 2004Micron Technology, Inc.Exposed to radiation at a first wavelength to cure the planarization material and is exposed to radiation at a second wavelength to cause changes to the planarization material that facilitate separationUS6679763Feb 20, 2002Jan 20, 2004Lam Research CorporationApparatus and method for qualifying a chemical mechanical planarization processUS6683003Apr 23, 2001Jan 27, 2004Micron Technology, Inc.Global planarization method and apparatusUS6693034Aug 27, 2002Feb 17, 2004Micron Technology, Inc.Deadhesion method and mechanism for wafer processingUS6726545 *Apr 26, 2002Apr 27, 2004Chartered Semiconductor Manufacturing Ltd.Linear polishing for improving substrate uniformityUS6733615Sep 25, 2002May 11, 2004Lam Research CorporationMethod and apparatus for fixed abrasive substrate preparation and use in a cluster CMP toolUS6743724Apr 11, 2001Jun 1, 2004Micron Technology, Inc.Planarization process for semiconductor substratesUS6746320Apr 30, 2002Jun 8, 2004Lam Research CorporationLinear reciprocating disposable belt polishing method and apparatusUS6752698Mar 19, 2002Jun 22, 2004Lam Research CorporationMethod and apparatus for conditioning fixed-abrasive polishing padsUS6767427Jun 7, 2001Jul 27, 2004Lam Research CorporationApparatus and method for conditioning polishing pad in a chemical mechanical planarization processUS6776695Dec 21, 2000Aug 17, 2004Lam Research CorporationPlaten design for improving edge performance in CMP applicationsUS6796880Mar 21, 2003Sep 28, 2004Applied Materials, Inc.Linear polishing sheet with windowUS6808442 *Dec 20, 2001Oct 26, 2004Lam Research CorporationApparatus for removal/remaining thickness profile manipulationUS6814834May 31, 2002Nov 9, 2004Micron Technology, Inc.Apparatus and method for reducing removal forces for CMP padsUS6828227Nov 6, 2002Dec 7, 2004Micron Technology, Inc.Method for applying uniform pressurized film across waferUS6875085 *Sep 23, 2002Apr 5, 2005Mosel Vitelic, Inc.Polishing system including a hydrostatic fluid bearing supportUS6875091Feb 28, 2001Apr 5, 2005Lam Research CorporationMethod and apparatus for conditioning a polishing pad with sonic energyUS6913521Jun 22, 2004Jul 5, 2005Lam Research CorporationMethods using active retainer rings for improving edge performance in CMP applicationsUS6936133Sep 26, 2002Aug 30, 2005Lam Research CorporationMethod and apparatus for fixed abrasive substrate preparation and use in a cluster CMP toolUS6939207Oct 3, 2003Sep 6, 2005Lam Research CorporationMethod and apparatus for controlling CMP pad surface finishUS6955588Mar 31, 2004Oct 18, 2005Lam Research CorporationMethod of and platen for controlling removal rate characteristics in chemical mechanical planarizationUS6971950Oct 22, 2003Dec 6, 2005Praxair Technology, Inc.Polishing silicon wafersUS6991517Mar 31, 2004Jan 31, 2006Applied Materials Inc.Linear polishing sheet with windowUS6991740May 24, 2004Jan 31, 2006Micron Technology, Inc.Method for reducing removal forces for CMP padsUS7018273Jun 27, 2003Mar 28, 2006Lam Research CorporationPlaten with diaphragm and method for optimizing wafer polishingUS7059937May 12, 2005Jun 13, 2006Micron Technology, Inc.Systems including differential pressure application apparatusUS7285037Apr 25, 2006Oct 23, 2007Micron Technology, Inc.Systems including differential pressure application apparatusUS7303599 *May 25, 2004Dec 4, 2007Kazumasa OhnishiManufacture of lapping boardUS7329171Sep 12, 2003Feb 12, 20083M Innovative Properties CompanyFixed abrasive article for use in modifying a semiconductor waferUS7585425Jan 25, 2006Sep 8, 2009Micron Technology, Inc.Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement; for semiconductor wafer chemical mechanical polishing (CMP)US7591708 *Sep 26, 2005Sep 22, 2009Applied Materials, Inc.Method and apparatus of eddy current monitoring for chemical mechanical polishingUS7717769Nov 30, 2007May 18, 2010Kazumasa OhnishiManufacture of lapping boardUS7935216Feb 28, 2005May 3, 2011Round Rock Research, LlcDifferential pressure application apparatus for use in polishing layers of semiconductor device structures and methodsUS7947190 *Nov 17, 2003May 24, 2011Round Rock Research, LlcMethods for polishing semiconductor device structures by differentially applying pressure to substrates that carry the semiconductor device structuresUS8268115Apr 26, 2011Sep 18, 2012Round Rock Research, LlcDifferential pressure application apparatus for use in polishing layers of semiconductor device structures and methodsUS8308528Aug 4, 2009Nov 13, 2012Round Rock Research, LlcApparatus and method for reducing removal forces for CMP pads* Cited by examinerClassifications U.S. Classification451/173, 451/307, 451/168International ClassificationB24B37/26, H01L21/304, B24B21/00, B24D99/00Cooperative ClassificationB24B21/00, B24D7/06, B24B37/26European ClassificationB24B37/26, B24D7/06, B24B21/00Legal EventsDateCodeEventDescriptionJan 6, 2009FPExpired due to failure to pay maintenance feeEffective date: 20081119Nov 19, 2008LAPSLapse for failure to pay maintenance feesMay 26, 2008REMIMaintenance fee reminder mailedMay 18, 2008ASAssignmentOwner name: APPLIED MATERIALS, INC., CALIFORNIAFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LAM RESEARCH CORPORATION;REEL/FRAME:020951/0935Effective date: 20080108May 5, 2004FPAYFee paymentYear of fee payment: 8Feb 11, 2000FPAYFee paymentYear of fee payment: 4Jan 10, 2000ASAssignmentOwner name: LAM RESEARCH CORPORATION, CALIFORNIAFree format text: MERGER;ASSIGNOR:ONTRAK SYSTEMS, INC.;REEL/FRAME:010531/0127Effective date: 19990625Owner name: LAM RESEARCH CORPORATION 4650 CUSHING PKWY FREMONTSep 2, 1997ASAssignmentOwner name: LAM RESEARCH CORPORATION, CALIFORNIAFree format text: MERGER;ASSIGNOR:ONTRAK SYSTEMS, INC.;REEL/FRAME:008677/0713Effective date: 19970805Oct 11, 1994ASAssignmentOwner name: ONTRAK SYSTEMS, INC., CALIFORNIAFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TALIEH, HOMAYOUN;WELDON, DAVID E.;REEL/FRAME:007200/0360Effective date: 19941007RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services©2012 Google
Patent US5575707 - Polishing pad cluster for polishing a semiconductor wafer - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inAdvanced Patent SearchPatentsA polishing pad cluster for polishing a semiconductor wafer having multiple integrated circuit dies includes a pad support and multiple polishing pads. Each pad has a polishing area substantially smaller than the wafer but not substantially smaller than an individual one of the integrated circuit dies....http://www.google.com/patents/US5575707?utm_source=gb-gplus-sharePatent US5575707 - Polishing pad cluster for polishing a semiconductor waferAdvanced Patent SearchPublication numberUS5575707 APublication typeGrantApplication numberUS 08/321,169Publication dateNov 19, 1996Filing dateOct 11, 1994Priority dateOct 11, 1994Fee statusLapsedAlso published asDE69512170D1, DE69512170T2, DE69525665D1, DE69525665T2, EP0706856A1, EP0706856B1, EP0919330A1, EP0919330B1Publication number08321169, 321169, US 5575707 A, US 5575707A, US-A-5575707, US5575707 A, US5575707AInventorsHomayoun Talieh, David E. WeldonOriginal AssigneeOntrak Systems, Inc.Export CitationBiBTeX, EndNote, RefManPatent Citations (17), Non-Patent Citations (4), Referenced by (99), Classifications (13), Legal Events (9) External Links: USPTO, USPTO Assignment, EspacenetPolishing pad cluster for polishing a semiconductor waferUS 5575707 AAbstract A polishing pad cluster for polishing a semiconductor wafer having multiple integrated circuit dies includes a pad support and multiple polishing pads. Each pad has a polishing area substantially smaller than the wafer but not substantially smaller than an individual one of the integrated circuit dies. Each polishing pad is mounted to a respective polishing pad mount, which is in turn supported by the support. Each mount includes a respective joint having at least two degrees of freedom to allow the associated polishing pad to articulate with respect to the support to conform to the wafer. Each mount is substantially rigid in a direction perpendicular to the pad toward the pad support, and in some cases the adjacent mounts are completely isolated from one another. A magnet is used to bias the polishing pad against the wafer.
Patent CitationsCited PatentFiling datePublication dateApplicantTitleUS3654739 *Feb 5, 1970Apr 11, 1972Metabowerke KgBelt grinding or polishing machineUS4128968 *Sep 22, 1976Dec 12, 1978The Perkin-Elmer CorporationOptical surface polisherUS4601134 *Jan 14, 1985Jul 22, 1986Karl Heesemann Maschinenfabrik Gmbh & Co. KgBelt grinder having pressure pads with individually variable contact pressuresUS4802309 *Aug 6, 1987Feb 7, 1989Carl-Zeiss-StiftungMethod and apparatus for lapping and polishing optical surfacesUS4811522 *Mar 23, 1987Mar 14, 1989Gill Jr Gerald LCounterbalanced polishing apparatusUS5205082 *Dec 20, 1991Apr 27, 1993Cybeq Systems, Inc.Wafer polisher head having floating retainer ringUS5212910 *Jul 9, 1991May 25, 1993Intel CorporationComposite polishing pad for semiconductor processUS5230184 *Jul 5, 1991Jul 27, 1993Motorola, Inc.Distributed polishing headUS5287663 *Apr 28, 1992Feb 22, 1994National Semiconductor CorporationPolishing pad and method for polishing semiconductor wafersUS5297361 *Jul 16, 1993Mar 29, 1994Commissariat A L'energie AtomiquePolishing machine with an improved sample holding tableUS5329732 *Jun 15, 1992Jul 19, 1994Speedfam CorporationWafer polishing method and apparatusUS5329734 *Apr 30, 1993Jul 19, 1994Motorola, Inc.Polishing pads used to chemical-mechanical polish a semiconductor substrateUS5335453 *Sep 27, 1993Aug 9, 1994Commissariat A L'energie AtomiquePolishing machine having a taut microabrasive strip and an improved wafer support headEP0118126A2 *Mar 3, 1984Sep 12, 1984Aida Engineering Ltd.Magnetic attraction system grinding methodEP0478912A2 *Jul 23, 1991Apr 8, 1992Peter Wolters AgWorking disc for lapping, honing and polishing machineFR796866A * Title not availableJPS5914469A * Title not available* Cited by examinerNon-Patent CitationsReference1"A New Pad and Equipment Development for ILD Planarization" by Toshiyasu Beppu, Motoyuki Obara and Yausuo Minamikawa, Semiconductor World, Jan., 1994, MY Mar. 17, 1994.2"Application of Chemical Mechanical Polishing to the Fabrication of VLSI Circuit Interconnections", William J. Patrick, William L. Guthrie, Charles L. Stadley and Paul M. Schiable, J. Electrochem. Soc., vol. 138, No. 6, Jun. 1991, pp. 1778-1784.3 *A New Pad and Equipment Development for ILD Planarization by Toshiyasu Beppu, Motoyuki Obara and Yausuo Minamikawa, Semiconductor World, Jan., 1994, MY Mar. 17, 1994.4 *Application of Chemical Mechanical Polishing to the Fabrication of VLSI Circuit Interconnections , William J. Patrick, William L. Guthrie, Charles L. Stadley and Paul M. Schiable, J. Electrochem. Soc., vol. 138, No. 6, Jun. 1991, pp. 1778 1784.* Cited by examinerReferenced byCiting PatentFiling datePublication dateApplicantTitleUS5722877 *Oct 11, 1996Mar 3, 1998Lam Research CorporationTechnique for improving within-wafer non-uniformity of material removal for performing CMPUS5916012 *Jun 25, 1997Jun 29, 1999Lam Research CorporationControl of chemical-mechanical polishing rate across a substrate surface for a linear polisherUS5961372 *Dec 5, 1995Oct 5, 1999Applied Materials, Inc.Substrate belt polisherUS6030275 *Mar 17, 1998Feb 29, 2000International Business Machines CorporationVariable control of carrier curvature with direct feedback loopUS6036586 *Jul 29, 1998Mar 14, 2000Micron Technology, Inc.Apparatus and method for reducing removal forces for CMP padsUS6059643 *Feb 21, 1997May 9, 2000Aplex, Inc.Apparatus and method for polishing a flat surface using a belted polishing padUS6062133 *Apr 7, 1999May 16, 2000Micron Technology, Inc.Global planarization method and apparatusUS6068542 *Jun 25, 1997May 30, 2000Tomoe Engineering Co, Ltd.Pad tape surface polishing method and apparatusUS6083839 *Dec 31, 1997Jul 4, 2000Intel CorporationUnique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process controlUS6086460 *Nov 9, 1998Jul 11, 2000Lam Research CorporationMethod and apparatus for conditioning a polishing pad used in chemical mechanical planarizationUS6126512 *Jul 10, 1998Oct 3, 2000Aplex Inc.Robust belt tracking and control system for hostile environmentUS6146249 *Oct 22, 1998Nov 14, 2000Aplex, Inc.Apparatus and method for polishing a flat surface using a belted polishing padUS6155913 *Apr 12, 1999Dec 5, 2000Chartered Semiconductor Manuf. Ltd.Double polishing headUS6179709Feb 4, 1999Jan 30, 2001Applied Materials, Inc.In-situ monitoring of linear substrate polishing operationsUS6200199Mar 31, 1998Mar 13, 2001Applied Materials, Inc.Chemical mechanical polishing conditionerUS6218316Oct 22, 1998Apr 17, 2001Micron Technology, Inc.Planarization of non-planar surfaces in device fabricationUS6237483Mar 30, 2000May 29, 2001Micron Technology, Inc.Global planarization method and apparatusUS6241585Jun 25, 1999Jun 5, 2001Applied Materials, Inc.Apparatus and method for chemical mechanical polishingUS6261959Mar 31, 2000Jul 17, 2001Lam Research CorporationMethod and apparatus for chemically-mechanically polishing semiconductor wafersUS6269511Oct 4, 2000Aug 7, 2001Micron Technology, Inc.Surface cleaning apparatusUS6273100Aug 27, 1998Aug 14, 2001Micron Technology, Inc.Surface cleaning apparatus and methodUS6296550Nov 16, 1998Oct 2, 2001Chartered Semiconductor Manufacturing Ltd.Scalable multi-pad design for improved CMP processUS6306019Dec 30, 1999Oct 23, 2001Lam Research CorporationMethod and apparatus for conditioning a polishing padUS6315857 *Jul 10, 1998Nov 13, 2001Mosel Vitelic, Inc.Polishing pad shaping and patterningUS6316363Sep 2, 1999Nov 13, 2001Micron Technology, Inc.Deadhesion method and mechanism for wafer processingUS6328637Jul 10, 2000Dec 11, 2001Lam Research CorporationMethod and apparatus for conditioning a polishing pad used in chemical mechanical planarizationUS6328642Feb 14, 1997Dec 11, 2001Lam Research CorporationIntegrated pad and belt for chemical mechanical polishingUS6331488May 23, 1997Dec 18, 2001Micron Technology, Inc.Planarization process for semiconductor substratesUS6336845Nov 12, 1997Jan 8, 2002Lam Research CorporationMethod and apparatus for polishing semiconductor wafersUS6336851Aug 4, 1999Jan 8, 2002Applied Materials, Inc.Substrate belt polisherUS6361414Jun 30, 2000Mar 26, 2002Lam Research CorporationApparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization processUS6361423Dec 22, 2000Mar 26, 2002Applied Materials, Inc.Chemical mechanical polishing conditionerUS6390890Feb 3, 2000May 21, 2002Charles J MolnarUsing abrasive mixture of resin and particlesUS6398905Jan 6, 2000Jun 4, 2002Micron Technology, Inc.Fluoropolymer coating on a platen allows for removal of polishing pads with pressure sensitive adhesives; used for smoothening semiconductor wafers and optical lensesUS6402591Mar 31, 2000Jun 11, 2002Lam Research CorporationPlanarization system for chemical-mechanical polishingUS6403499Feb 21, 2001Jun 11, 2002Micron Technology, Inc.Planarization of non-planar surfaces in device fabricationUS6406363Aug 31, 1999Jun 18, 2002Lam Research CorporationUnsupported chemical mechanical polishing beltUS6416385Jun 22, 2001Jul 9, 2002Lam Research CorporationMethod and apparatus for polishing semiconductor wafersUS6425812Dec 30, 1999Jul 30, 2002Lam Research CorporationPolishing head for chemical 
mechanical polishing using linear planarization technologyUS6428394Mar 31, 2000Aug 6, 2002Lam Research CorporationMethod and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feedUS6431959Dec 20, 1999Aug 13, 2002Lam Research CorporationSystem and method of defect optimization for chemical mechanical planarization of polysiliconUS6435952Jun 30, 2000Aug 20, 2002Lam Research CorporationApparatus and method for qualifying a chemical mechanical planarization processUS6454641 *Nov 7, 2000Sep 24, 2002David E. WeldonHydrostatic fluid bearing support with adjustable inlet heightsUS6495464Jun 30, 2000Dec 17, 2002Lam Research CorporationMethod and apparatus for fixed abrasive substrate preparation and use in a cluster CMP toolUS6500056Jun 30, 2000Dec 31, 2002Lam Research CorporationLinear reciprocating disposable belt polishing method and apparatusUS6506679Aug 29, 2001Jan 14, 2003Micron Technology, Inc.Deadhesion method and mechanism for wafer processingUS6517418Jun 22, 2001Feb 11, 2003Lam Research CorporationMethod of transporting a semiconductor wafer in a wafer polishing systemUS6518172Aug 29, 2000Feb 11, 2003Micron Technology, Inc.Method for applying uniform pressurized film across waferUS6533646Dec 21, 2000Mar 18, 2003Lam Research CorporationPolishing head with removable subcarrierUS6554688Jan 4, 2001Apr 29, 2003Lam Research CorporationMethod and apparatus for conditioning a polishing pad with sonic energyUS6585563Nov 28, 2000Jul 1, 2003Applied Materials, Inc.In-situ monitoring of linear substrate polishing operationsUS6607425 *Dec 21, 2000Aug 19, 2003Lam Research CorporationPressurized membrane platen design for improving performance in CMP applicationsUS6609961Jan 9, 2001Aug 26, 2003Lam Research CorporationChemical mechanical planarization belt assembly and method of assemblyUS6612917Feb 7, 2001Sep 2, 20033M Innovative Properties CompanyAbrasive article suitable for modifying a semiconductor waferUS6616801Mar 31, 2000Sep 9, 2003Lam Research CorporationMethod and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process pathUS6626743Mar 31, 2000Sep 30, 2003Lam Research CorporationMethod and apparatus for conditioning a polishing padUS6632129Feb 15, 2001Oct 14, 20033M Innovative Properties CompanyFixed abrasive article for use in modifying a semiconductor waferUS6641463 *May 20, 2002Nov 4, 2003Beaver Creek Concepts IncUnitary refining element having a plurality of discrete refining members for refining a semiconductor wafer; 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